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Sathyabama Institute of Science and Technology B.E. - Electronics and Telecommunication Engineering SECA3007 MEMS and its applications Syllabus

SATHYABAMA INSTITUTE OF SCIENCE AND TECHNOLOGY SCHOOL OF ELECTRICAL AND ELECTRONICS ENGINEERING

SECA3007 MEMS AND ITS APPLICATIONS
L T P Credits Total Marks
3 0 0 3 100

UNIT 1 OVERVIEW OF MEMS AND MICROSYSTEMS 9 Hrs.
Definition - historical development - Fundamentals - Properties, Introduction to Design of MEMS and NEMS, MEMS,
Microsystems microelectronics, miniaturization, Working principle of micro system - Micro sensors, Micro actuators, Micro
accelerometers and Micro fluidics, MEMS materials: Silicon, silicon compounds, polymers, metals.

UNIT 2 MEMS FABRICATION 9 Hrs.
Micro-system fabrication processes: Photolithography, Ion Implantation, Diffusion, and Oxidation. Thin film depositions:
LPCVD, Sputtering, Evaporation, Electroplating; Etching techniques: Dry and wet etching, electrochemical etching;
Micromachining: Bulk Micromachining, Surface Micromachining, High Aspect-Ratio (LIGA and LIGA-like) Technology.

UNIT 3 MICRO SENSORS AND ACTUATORS 9 Hrs.
Micro-sensing for MEMS: Piezo-resistive Pressure Sensor, Capacitive sensor, Piezoelectric sensing, Resonant sensing,
Surface Acoustic Wave sensors Vibratory gyroscope, Electromechanical transducers: Piezoelectric transducers,
Electrostrictive transducers, Magnetostrictive transducers, Electrostatic actuators, Electromagnetic transducers, Electrodynamic
transducers, Case study-Piezo-resistive pressure sensor, Comb drive actuators.

UNIT 4 MEMS DESIGN AND INTRODUCTION TO OPTICAL RF MEMS 9 Hrs.
Micro system Design - Design consideration, process design, Mechanical design, Mechanical design using MEMS. Optical
MEMS, - System design basics - Gaussian optics, Matrix operations, Resolution. MEMS scanners and retinal scanning
display, Digital Micro mirror devices. RF Memes - Design basics, case study - Capacitive RF MEMS switch, Performance
issues.

UNIT 5 MEMS PACKAGING AND APPLICATIONS 9 Hrs.
MEMS packaging: Role of MEMS packaging, Types of MEMS packaging, selection of packaging materials, flip-chip and
multichip Unit packaging, RF MEMS packaging issues. Micro-machined transmission line and components, micro-machined
RF Filters, Micromachined Phase shifters, and Micro-machined antenna, Gyros and Bio-MEMS. Recent trends in MEMS.
Max. 45 Hrs.

COURSE OUTCOMES
On completion of the course, student will be able to
CO1 - Understand the basics of MEMS technology and Microsystems.
CO2 - Acquire knowledge in the types and procedures involved in MEMS fabrication.
CO3 - Apply the acquired knowledge in understanding MEMS sensors and actuators.
CO4 - Analyse various MEMS design and familiarise with optical RF MEMS.
CO5 - Investigate various applications of MEMS.
CO6 - Develop real time MEMS based devices.

TEXT / REFERENCE BOOKS
1. Vijay K. Varadan, K.J. Vinoy and K.A. Jose, “RF MEMS & Their Applications”, John Wiley & Sons, 2003.
2. Tai - Rai Hsu, “MEMS and Microsystems Design and Manufacturing”, Tata McGraw Hill, New Delhi, Edition 2002.
3. Gabriel M Rebeiz, “RF MEMS - Theory Design and Technology”, John Wiley and Sons, 2003.
4. Nadim Maluf, “An introduction to Micro electro mechanical system design”, Artech House, 2000.

END SEMESTER EXAMINATION QUESTION PAPER PATTERN
Max. Marks: 100 Exam Duration: 3 Hrs.
PART A: 10 Questions of 2 marks each - No choice 20 Marks
PART B: 2 Questions from each unit of internal choice, each carrying 16 marks 80 Marks